BGA rework stationT-890, bga chip repair machine for motherboards, new BGA reball rework station,taian, soldering station
BGA rework stationT-890, bga chip repair machine for motherboards, new BGA reball rework station,taian, soldering station
BGA rework stationT-890, bga chip repair machine for motherboards, new BGA reball rework station,taian, soldering station

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BGA rework stationT-890, bga chip repair machine for motherboards, new BGA reball rework station,taian, soldering station

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Model No. : T-890
Brand Name : SUNY

Product description

Specifications BGA rework stationT-890, bga chip repair machine

for motherboards, new bga reball rework station, soldering station

Product:  BGA rework stationT-890, bga chip repair machine for motherboards, new bga reball rework station,taian, soldering station   Model: T-890     Features
1. This machine has the strong and perfect function selection, with eight temperature waves in the memory software, you can select the right temperature wave according to the solder/unsolder request.
2. Intelligent temperature wave heating, can achieve the solder/unsolder automatically.
3. Three-dimensional adjustable lamp body, use laser light, suitable for unsoldering any-angle components.
4. PID intelligent temperature control can avoid the IC damage due to the fast or uninterrupted warming up.
5. This machine has a super hot melt system, use infrared welding technology which is developed independently, heat is easy to pierce and distribute evenly, can suit for a variety of computer, notebook, play station’s BGA components, especially suits to the computer north and south bridge.
6. Friendly human-machine operation interface, perfect LCD display, you can watch the whole repairing process very clearly.
7. Ergonomic design, practical and easily operated. Good build quality but at the same time light weight and a small footprint allows the T-890 to be easily bench positioned, transported or stored.         Technical parameters

Complete machine power

1500W

Rated voltage and frequency

AC 110-230 V  60/50Hz

Infrared lamp body power

300 W

Preheating chassis power

1200 W

Working bench size

320 X 330 mm

Infrared lamp body heating size

60 X 60 mm

Preheating chassis preheating size

245 X 260 mm

Preheating chassis temperature range

°C-350 °C

Size

316mm X 410mm X 290mm

Net weight

9.3 kg

   
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