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6 L Smart Phone Board 0.076mm Line OSP+Enig Finishing 0.5mm Thickness UL Approved (KG-M6-008)
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| Model No. : | KG-M6-008 |
|---|
Kaige Group Co., Ltd.
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Product description
Model No.: KG-M6-008
Number of Layers: 6L smart phone board
Base-Material: FR4
Thickness: 0.5 mm+/-10%
Final-Cu: 35/35um
Impedance: No
Blind and buried via: No
Min. Drill hole: 0.2mm
Min. Line space: 0.076mm
Min. Line width: 0.076mm
Mech. Treatment: Routing
Surface Treatment: OSP+ENIG
Solder-Mask: Green
Legend-Print: White
100% E-Test: Yes
![6 L Smart Phone Board 0.076mm Line OSP+Enig Finishing 0.5mm Thickness UL Approved (KG-M6-008)]()
Number of Layers: 6L smart phone board
Base-Material: FR4
Thickness: 0.5 mm+/-10%
Final-Cu: 35/35um
Impedance: No
Blind and buried via: No
Min. Drill hole: 0.2mm
Min. Line space: 0.076mm
Min. Line width: 0.076mm
Mech. Treatment: Routing
Surface Treatment: OSP+ENIG
Solder-Mask: Green
Legend-Print: White
100% E-Test: Yes
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