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4layers Pcb Fabrication With Non-halogen Material And Immersion Silver Finishing
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Shenzhen Tianweisheng Electronic Co., Ltd.
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Product description
Specifications
1.UL, SGS Test, RoHS Certification, ISO9001:2008
2.1-16 layer:FR-4, Alu,
3.Short lead time
4.9 years factory experience
2.1-16 layer:FR-4, Alu,
3.Short lead time
4.9 years factory experience
We can do for you:
1-16 layer FR-4 PCB board, 1-2 layer Aluminum PCB
1-6 oz copper thickness
0.2 mm hole size
0.1 mm line width/space
Our PCBs are used for wide range of electronic products,
Like Medical devices, CCTV, Power supply, GPS, UPS, Set-top Box,
Telecomunication ,LED, etc.
Factory Manufacture Capability.
Item |
Manufacture Capability |
|
Material |
FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based |
|
Layer No. |
1-16 |
|
Finished Board thickness |
0.2 mm-3.8mm'(8 mil-150 mil) |
|
Board Thickness Tolerance |
±10% |
|
Cooper thickness |
0.5 OZ-11OZ (18 um-385 um) |
|
Copper Plating Hole |
18-40 um |
|
Impedance Control |
±10% |
|
Warp&Twist |
0.70% |
|
Peelable |
0.012"(0.3mm)-0.02'(0.5mm) |
|
Images | ||
Min Trace Width (a) |
0.1mm (4 mil) |
|
Min Space Width (b) |
0.1mm (4 mil) |
|
Min Annular Ring |
0.1mm (4 mil) |
|
SMD Pitch (a) |
0.2 mm(8 mil) |
|
BGA Pitch (b) |
0.2 mm (8 mil) |
|
Solder Mask | ||
Min Solder Mask Dam (a) |
0.0635 mm (2.5mil) |
|
Soldermask Clearance (b) |
0.1mm (4 mil) |
|
Min SMT Pad spacing (c) |
0.1mm (4 mil) |
|
Solder Mask Thickness |
0.0007"(0.018mm) |
|
Holes | ||
Min Hole size (CNC) |
0.2 mm (8 mil) |
|
Min Punch Hole Size |
0.9 mm (35 mil) |
|
Hole Size Tol (+/-) |
PTH:±0.075mm;NPTH: ±0.05mm |
|
Hole Position Tol |
±0.075mm |
|
Plating | ||
HASL |
2.5um |
|
Lead free HASL |
2.5um |
|
Immersion Gold |
Nickel 3-7um Au:1-5u'' |
|
OSP |
0.2-0.5um |
|
Outline | ||
Panel Outline Tol (+/-) |
CNC: ±0.125mm, Punching: ±0.15mm |
|
Beveling |
30°45° |
|
Gold Finger angle |
15° 30° 45° 60° |
|
Certificate |
ROHS, ISO9001:2008, SGS, UL certificate |
|
View of our Plant:
Our lead time:
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