Spot Gluing Machine Robot Arm for LED

Specifications

Robot Arm for LED :
Packaging and bonding the LCD glass plate, Gluing the Electronic boards..
Resolution is as high as 0.01 mm

 

 

Product name:  Spot Gluing Machine-Robot Arm for LED

 

Application:

 

1. Packaging the semi-conductor

2. Fixing and protecting PCB electronic parts.

3. Packaging and bonding the LCD glass plate.

4. Gluing the Electronic boards and buttons

5. Gluing the Microphones.

6. Gluing and packaging the battery containers

7. Bonding the auto parts

8. Coating and bonding the hardware fittings.

9. Bonding the chips.

 

Applicable adhesive:

 

UV adhesive, silicom, epoxy, silicone sealant, AB adhesive, conductive adhesive, Thermal aluminum paste, instant glue and ect.

 

Feature:

 

1. Particularly suitable for FIPG (Form-in-place gaskets) spot gluing, paste, infusion, pouring and filling gluing.

2. Resolution is as high as 0.01 mm;

3. Continuous movement and point-to-point movement.

4. Control panel is equipped with shortcut button which could set glue spraying.

5. With the function of repeat-setting, it can be used for multiple identical products in spot gluing.

6. It can store 100 program and every program has 50000 point with the memory capacity of 5 million-point

7. With USB port devices, the machine could be connected with a computer to achieve data transfer, system-updating and program-replacing

 

Specification:

 

Item	Unit	YX-040
X/Y/Z Work Area	mm	400/400/200
Carrying Capacity for Operating Platform and Holder	Kg	10kg/5kg
X/Y/Z Maximum Speed	mm/sec	800/320
Repeat-Setting Precision	mm	±0.02
Storage Capacity	P	100 Programs 50,000 Points/Programs
50000 Points/Program		JMC-A3 Driving System: JMC-A3
I/O Signal		8I/8O
Way of Port		USB/RS232
Power Supply	V	AC220V
Working Temperature	°C	0-60 °C
Relative Humidity		5-90%
Overall Size	mm	782/797/887

 

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