sliver/gold semiconductor ceramic ntc bare chip thermistor for bonding 10k

DT series NTC thermistor is the newest development in chip NTC thermistors. The miniature package is designed for hybrid applications where bonding wire or Au/Sn solder is used as the attachment method. The terminations on the top and bottom of the thermistor are gold (Au) plated for the ultimate in hybrid designs and construction.     Features: 1. High accuracy tolerances to +/-0.1°C 2. Excellent thermal cycle endurance 3. High stability,fast response 4. Firm construction,small size 5. Operating ranges from -50°C ~ +200°C 6. Electrode:sliver or gold        Application:   1. Hybrid designs and construction, bonding 2. High Precision NTC Temperature sensor 3. Infrared thermopiles 4. Thermal printer          Parameter list:   ELECTRONIC PARAMETER SPECIFICATON

Part No.	R25 (KΩ)	B(K)	Rated Power  @25mw	Dissipation factor(δ) (mW/)	Thermal time constant (s)
DT1023150A	1.0kΩ	3150 K	15	2.5	15
DT2023150A	2.0kΩ	3150 K	15	2.5	15
DT5023274A	5.0kΩ	3274K	15	2.5	15
DT5023435B	5.0kΩ	3435K	15	2.5	15
DT5023470A	5.0 kΩ	3470K	15	2.5	15
DT5023950A	5.0kΩ	3950K	15	2.5	15
DT1033274A	10.0kΩ	3274K	15	2.5	15
DT1033435B	10.0kΩ	3435K	15	2.5	15
DT1033470A	10.0kΩ	3470K	15	2.5	15
DT1033950A	10.0kΩ	3950K	15	2.5	15
DT1034100A	10.0kΩ	4100K	15	2.5	15
The B-tolerance is ±1 when R--tolerance within ±3, others are ±2%.
Special part number could be customizing.

    Equipments & Inspection:             Exsense culture:             Quality guarantee period:   We promise this product can be used for 5 years at least by normal use.       Plant show:             Packing:   1. Bulk in vacuum bag. 2. Bulk in glass bottle. 3. Blue thin.       Other products: