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Product description
NO |
ITEM |
Technical capabilities |
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1 |
Layers |
1-30 layers |
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2 |
Max. Board size |
2000×610mm |
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3 |
Min. board Thickness |
2-layer 0.15mm
|
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4 |
Min. line Width/Space |
0.075mm(3mil) |
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5 |
Max. Copper thickness |
6OZ |
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6 |
Min. S/M Pitch |
0.075mm(3mil) |
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7 |
Min. hole size |
0.1mm(4mil) |
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8 |
Hole dia. Tolerance (PTH) |
±0.05mm(2mil) |
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9 |
Hole dia. Tolerance (NPTH) |
+0/-0.05mm(2mil) |
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10 |
Hole position deviation |
±0.05mm(2mil) |
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11 |
Outline tolerance |
±0.10mm(4mil) |
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12 |
Twist & Bent |
0.75% |
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13 |
Insulation Resistance |
>1012 Ω Normal |
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14 |
Electric strength |
>1.3kv/mm |
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15 |
S/M abrasion |
>6H |
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16 |
Thermal stress |
288°C 20Sec |
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17 |
Test Voltage |
50-300V |
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18 |
Min. blind/buried via |
0.15mm (6mil) |
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19 |
Surface Finished |
HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
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20 |
Materials |
FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |
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