Product description
RJ45 SIDE ENTRY SMT PCB JACK
Specifications:
MATERIAL:
1.HOUSING MATERIAL :GLASS FILLED POLYESTER UL94V-0.
2.CONTACT MATERIAL :PHOSPHOR BRONZE t=0.35mm
3.PLATING:SELECTING GOLD PLATING
1u"~50u"OVER NICKEL IN CONTACT AREA.150u"TIN PLATING
OVER NICKEL IN SOLDER AREA.
4.SHIELD :0.25mm THICKNESS COPPER ALLY WITH NICKEL .PLATEL
ELECTRICAL:
1.VOLTAGE PATING :125 VAC RMS.
2.CURRENT PATING:1.5 AMP
3.CONTACT RESISTANCE:35 MILLIOHMS MAX
4.INSULATION RESISTANCE:1000 MEGOHMS MIN @ 500V DC.
5.DIELECTRIC WITHSTANDING RESISTANCE: 1000V AC RMS 60Hz.1MIN
MECHANICAL:
1.DURRABILITY :750 CYCLES MIN
2.PCB RETENTION PRE-SOLDER :10LB MIN
ENVIRONMENTAL:
1.STORAGE:-40℃ TO +85℃ .
2.OPERATION :-40℃ TO +85℃ .
3.IR REFLOW SOLDERING TEMPERRATURE:255~265℃(5~10 SECONDS)MATES WITH MODULAR PLUG CONFORMING TO FCC PART 68 SUBPART F.