Sensor Dies for Automotive Application

Name: Sensor Dies for Automotive Application
Brand: Morning Star Transducer (MST) Technology Co. Ltd
Rating: 4.6 (14 reviews)

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Model No. :	SE101
Brand Name :

10yrs

Xi'an, Shaanxi, China

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Morning Star Transducer (MST) Technology Co. Ltd

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Product description

Description:

Designed for automotive application and operated on piezoresistive effect
Manufactured by micro-electromechanical systems (MEMS) technology, this sensor die has silicon-on-silicon structure with dimensions of 1 x 1 x 0.6mm
Due to its unique design of pressure diaphragm, possesses not only high sensitivity but also extraordinary overload pressure
As an uncompensated sensor die, available in an open-bridge circuit with 5 solder pads for both adjustment and temperature compensation of zero offset
Can also have customized parameters (e.g. die with closed-bridge circuit of 4 solder pads or with customized pressure range)
Thanks to modern MEMS fabrication facilities at BCM, can be produced as sensing element with consistent parameters for different ranges

Features:

Designed for absolute pressure applications
Small foot-print and stable zero offset
High sensitivity and extraordinary overload pressure
Identical 1 x 1mm foot-print for standard pressure ranges
Suitable for either constant voltage or current excitation

Applications:

Medical: clinical devices and patient monitoring systems (e.g. dialysis instruments)
Automotive: tire pressure monitoring, engine control and suspension control
Consumer: consumer electronics, portable tire-gauges and barometers (or altimeters)
Automation: pneumatic systems, leak detection, pressure switches and pressure controllers

Designed for automotive application and operated on piezoresistive effect

Manufactured by micro-electromechanical systems (MEMS) technology, this sensor die has silicon-on-silicon structure with dimensions of 1 x 1 x 0.6mm

Due to its unique design of pressure diaphragm, possesses not only high sensitivity but also extraordinary overload pressure

As an uncompensated sensor die, available in an open-bridge circuit with 5 solder pads for both adjustment and temperature compensation of zero offset

Can also have customized parameters (e.g. die with closed-bridge circuit of 4 solder pads or with customized pressure range)

Thanks to modern MEMS fabrication facilities at BCM, can be produced as sensing element with consistent parameters for different ranges

Designed for absolute pressure applications

Small foot-print and stable zero offset

High sensitivity and extraordinary overload pressure

Identical 1 x 1mm foot-print for standard pressure ranges

Suitable for either constant voltage or current excitation

Medical: clinical devices and patient monitoring systems (e.g. dialysis instruments)

Automotive: tire pressure monitoring, engine control and suspension control

Consumer: consumer electronics, portable tire-gauges and barometers (or altimeters)

Automation: pneumatic systems, leak detection, pressure switches and pressure controllers