Product description
Layer: single, double, multi-layer
Base material thickness: 12.5/25/50/75/100/12.5/25/35/50um
Copper conductor thickness: 18, 35, 50, 70, 105um
Minimum conductor space and width: 0.075 ±0.02mm
Minimum hole diameter: 0.2 ±0.03mm
Maximum panel size: 1,800 x 400mm
Flexibility R = 7, 120 times/minute
Movement distance: 20mm
Bending: 1 x 10' times (no fracture)
Peel strength: 1.0N/mm
Solder-ability: 160°C/5 seconds, 300°C/10 seconds
Insulation resistance: >500M©
Withstand voltage: >1000V/mm