Prototype flex circuits board

Our technical teams can produce your standard flex prototype in 5 days and developmental flex prototype in 15 days. Challenge us with multilayer, sub 2-mil thickness, tight registration, and a high number of traces. Give us your toughest HDI with a specific RF performance requirement. Ask us to make your flex circuits board smaller, lighter, and more reliable.

You now have a cost effective alternative to flat cable and expensive connector integration approaches: multi-layer flexible printed circuits where each layer is produced using adhesive and adhesiveless type polyimide (PI) film substrates with copper trace thicknesses ranging from 18um to 140um. Your design can be rendered into multilayer stackups that include single and multiple air gaps for conformal installations, conventional plated through hole (PTH) plating, plus coverlay and solder mask circuit protection.