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Model No. : | pcb-20010 |
---|---|
Brand Name : | Dr. Q |
Product description
No | Item | Specification |
1 | Layer | 1-20 layers |
2 | Board Material | FR4 glass fiber epoxy |
FR4 high Tg (Tg150, Tg160, Tg170, Tg180) | ||
Aluminum board | ||
3 | Surface Finishing | HASL Lead free |
Immersion gold, Immersion silver, Immersion Tin | ||
galvanic plating gold, galvanic plating silver | ||
4 | Board Thickness | 0.5mm-3.2mm |
5 | Copper Thickness | 17.5um-105um (0.5-3OZ) |
6 | Min. Hole Size | 0.1mm |
7 | Min. Line Width | 0.13mm (5mil) |
8 | Min. Line Spacing | 0.13mm (5mil) |
9 | Soldermask Color | Green, Black, White, Yellow, Blue, etc. |
10 | Silkscreen Color | White, Black,Yellow, Green, etc. |
11 | Max. Board Size | 1200mm*800mm |
12 | Board Type | Rigid, Flexible |
13 | Special Holes | Blind holes |
Buries holes | ||
14 | Profiling | Routing, V-cut, Punching, Chamfer |
15 | Test | E-test using adapter or Flying probe test |
Optical Inspection (to find every tiny defect of PCBs) | ||
16 | Standard | IPC-A-600G Class 3 (perfect or almost perfect) |
17 | Certificate | UL, RoHS, REACH, ISO |
No | Item | Specification |
1 | Type of Assembly | SMT Assembly (Surface-mounting technology) |
Thru-hole Assembly (Through-hole soldering Technology) | ||
2 | Solder Type | Water soluble solder paste, lead free |
3 | Component | Component sourcing service |
4 |
Test | ICT (In-circuit Test) |
FCT (Functional Test) | ||
5 | Min. IC Pitch | 0.30mm |
6 | Foot Pin | SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA |
7 | Min. Chip Placement | 1005 |
8 | Max. PCB Size | 600mm*400mm |
9 | Min. PCB Thickness | 0.35mm |
10 | Max. BGA Size | 74mm*74mm |
11 | Max. Ball Pitch | 1mm-3mm |
12 | Max. Ball Diameter | 0.4mm-1mm |
13 | QFP Lead Pitch | 0.38mm-2.54mm |
14 | Package | Inner package: anti-static bubble Bag |
Outer Package: carton box | ||
15 | Certificate | PCB Assembly with UL, RoHS approval |
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