Product description
Multilayer PCB with blind and buried hole capability
Reference: our production capability for rigid PCB
Layers: 1 to 28
Board finished thickness: 0.2 to 7.0mm
Material: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free, androgers
Maximum finished board size: 23 × 25 (580 ×900mm)
Minimum drilled hole size: 3mil (0.075mm)
Minimum line width: 3mil (0.075mm)
Minimum line spacing: 3mil (0.075mm)
Surface finish/treatment: HASL/HASL lead-free, HAL, chemicaltin, and chemical gold
Immersion silver/gold, OSP, and gold plating
Copper thickness: 0.5 to 7.0oz
Solder mask colors: green, yellow, black, white, red, andblue
Copper thickness in hole: >25.0µm (>1mil)
Inner packing: vacuum packing/plastic bag
Outer packing: standard carton packing
Shape tolerance: ±0.13
Hole tolerance:
Certifications: UL, ISO 9001, ISO 14001, SGS, and RoHS
Special requirements: buried and blind vias, controlledimpedance, and BGA
Profiling: punching, routing, V-cut, and beveling
Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products
PTH: ±0.076
NPTH: ±0.05