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Model No. : | clone pcb |
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Brand Name : | OEM |
Product description
1 | Layers | prototype pcba Single Sided, 2 to 36 Layer |
2 | Board material type | FR4 |
3 | Compound material lamination | 4 to 6 layers |
4 | Copper Thickness: | 1oz |
5 | Board Thickness: | 1.6mm |
6 | Min. Hole Diameter: | 0.15mm |
7 | Min. Line Width: | 0.1mm |
8 | Min. Line Spacing: | 0.1mm |
9 | Surface Finishing: | HASL lead free |
10 | Solder mask: | Green |
11 | Outer layer copper thickness | 8.75 to 175µm |
12 | Inner layer copper thickness | 17.5 to 175µm |
13 | Drilling hole diameter (mechanical drill) | 0.25 to 6.00mm |
14 | Finished hole diameter (mechanical drill) | 0.20 to 6.00mm |
15 | Hole diameter tolerance (mechanical drill) | 0.05mm |
16 | Hole position tolerance (mechanical drill) | 0.075mm |
17 | Laser drill hole size | 0.10mm |
18 | Board thickness and hole diameter ratio | 10:1 |
19 | Solder mask type | Green, Yellow, Black, Purple, Blue, White and Red |
20 | Minimum solder mask | Ø0.10mm |
21 | Minimum size of solder mask separation ring | 0.05mm |
22 | Solder mask oil plug hole diameter | 0.25 to 0.60mm |
23 | Impedance control tolerance | ±10% |
24 | Surface finish | Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger |
Technical Requirement | Professional Surface-mounting and Through-hole soldering Technology |
Various sizes like 1206, 0805, 0603 components SMT technology | |
ICT(In Circuit Test), FCT(Functional Circuit Test) technology | |
PCB Assembly With UL, CE, FCC, Rohs Approval | |
Nitrogen gas reflow soldering technology for SMT | |
High Standard SMT&Solder Assembly Line | |
High density interconnected board placement technology capacity | |
Quote&Production Requirement | Gerber File or PCB File for Bare PCB Board Fabrication |
BOM(Bill of Material) for Assembly, PNP(Pick and Place file) and Components Position also needed in assembly | |
To reduce the quote time, please provide us the full part number for each components, Quantity per board also the quantity for orders. | |
Testing Guide&Function Testing method to ensure the quality to reach nearly 0% scrap rate | |
OEM/ODM/EMS Services | PCBA, PCB assembly: SMT & PTH & BGA |
PCBA and enclosure design | |
Components sourcing and purchasing | |
Quick prototyping | |
Plastic injection molding | |
Metal sheet stamping | |
Final assembly | |
Test: AOI, In-Circuit Test (ICT), Functional Test (FCT) | |
Custom clearance for material importing and product exporting | |
Other PCB Assembly Equipments | SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4 |
Reflow Oven: FolunGwin FL-RX860 | |
Wave Soldering Machine: FolunGwin ADS300 | |
Automated Optical Inspection (AOI): Aleader ALD-H-350B,X-RAY Testing Service | |
Fully Automatic SMT Stencil Printer: FolunGwin Win-5 |
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