Laser Cutting Alumina Ceramic Substrate

Laser Cutting Alumina Ceramic Substrate

In order to obtain some complex custom designs and shapes in the industrial field, laser cutting is the most popular high-precision secondary processing method of alumina ceramic substrates, which is a more cost-effective manufacturing method than CNC machining.

Our Strength
1. Different patterns can be customized according to customer requirements.
2. Combine laser cutting with CNC machining to obtain higher dimensional accuracy.
3. The maximum cutting size is 152 x 152mm, and the best accuracy is +/-0.02mm.
4. The minimum cutting hole diameter is 0.1mm, and the maximum cutting thickness is 1.5mm.
5. Ability from sample production to mass production.

Product Application

Alumina ceramic is currently the most widely used ceramic packaging substrate material. It has excellent properties such as high strength, high temperature resistance, thermal shock resistance, electrical insulation and corrosion resistance.

96% alumina substrate: suitable for low-power electronic components, sensors, capacitors, micro-relays, microwave components and other fields.

99% alumina substrate: suitable for high-power LEDs, high-voltage integrated circuits, high-temperature sensors, high-frequency electronic components and other fields.