Half Slim Module SATA 32G SSD , Half slim For Industrial Pc/Pos Machine
Half Slim Module SATA 32G SSD , Half slim For Industrial Pc/Pos Machine
Half Slim Module SATA 32G SSD , Half slim For Industrial Pc/Pos Machine

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Half Slim Module SATA 32G SSD , Half slim For Industrial Pc/Pos Machine

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Model No. : H6302
Brand Name : BIWIN

Product description

  Half Slim Module SATA 32G SSD , Half slim For Industrial Pc/Pos Machine      Product Description          1.Product Specifications of Half Slim Module SATA 32G SSD    
Product Code H6302
Interface SATA III
Flash MLC
Density 16GB/32GB/64GB/128GB/256GB
Max Transfer Performance (Varies by density) Read:530MB/s
Write: 150MB/s
ECC BCH ECC 66 bits/1KB
Operating Voltage  +5V(±5%)
Power Consumption
 (Varies by density)
0.27W(idle)
1.90W(active)
Operating Temperature  0-70℃
Storage Temperature  -40-85℃
Humidity 5%-95%
MTBF 2,000,000 Hours
Shock 50(G),11(ms), half-sine wave
Vibration 3.1G(2-500Hz)
Dimension(mm) 54.00*39.00*4.00mm
Weight(g) ≤9.00g
  2.Product Pictures of Half Slim Module SATA 32G SSD       3.Application of Our Products       4.More Products for You to Choose         Company Information         5. Our Factory View       Our factory has full range of product line:
- PCI-E, 2.5”SATA, 2.5”PATA, 1.8”SATA, 1.8”PATA, Half Slim, NGFF, mSATA, mSATA Mini, SATA DOM, PATA DOM, USB DOM - Memory Card: CFast Card, CF Card;
- Embedded Chips: eMMC, eMCP;
Applicable to harsh operating temperature environments of industrial grade.   6.Trade Show     7.Certifications   Biwin has passed ISO 9001 ISO 14001 and been audited by SGS. All of our SSD products are RoHS directive-compliant and carry CE, FCC, RoHS approvals. We offer all the models with 3 years warranty.       Our Services      8. Our Services   Reliability Testing: - High and Low Temperature Storage
- High and Low Temperature Operation
- High and Low Temperature Cycling
- ESD Testing 
- Vibration and Shock Testing
- Room Temperature Aging Testing
- Power Failure Testing State-of-the-art Manufacturing:
- Quality Guaranteed Products
- Strict Quality Control Standards
- Short Lead Time
- Low Product Defect Rate
- Large production Capacity Wafer Packaging Service:
- First 12" Wafer Packaging Factory in South China
- Include IC Design, Packaging, Testing, Assembling
- Wafer Packaging Products:TSOP 48, QFN, QFP, BGA, LGA, eMMC, UDP.     9. Our Markets       10. Welcome to Contact Us        
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