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Product description
Place ofOrigin: | Guangdong China (Mainland) | BrandName: | HT | ModelNumber: | HT-2125 |
Base Material: | PI FR4 | Copper Thickness: | 1/2-2.0 | Board Thickness: | 0.05-3.0mm |
Min. Hole Size: | 0.2mm | Min. Line Width: | 0.05mm | Min. Line Spacing: | 0.05mm |
Surface Finishing: |
OSP PlatedTin Plated Ni/gold ENIG Plated Tin Plating
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Packaging Detail: | standard export carton packing or packing according to the customer'srequirement |
Delivery Detail: | 7days |
Flex PCB ProcessCapability
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Items
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General Process Capability
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Material:PI,PET
TraceTolerance:±20%
Hole diametertolerance:±3mil
ShapingProcessing:±0.13mm(special artwork is specialstandard)
EtchingTolerance:±0.015mm
MoldingTolerance:±0.05mm
Copper thickness:18μm,35μm,70μm
Reinforce Material:PI, FR4 steel 3M adhensive ,PET
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Product type
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Single Side
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Double Side
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Hollow board
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Multilayer FPC
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Rigid-flex board
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Layers
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1---6layers
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Finished BoardThickness
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0.05mm---2.0mm
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Min. holediameter
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0.2mm(CNC)(8mil)
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Min laser hole diameter
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0.1mm
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Min trace width andSpace
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1/3 OZ
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2.0mil/2.0mil
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1/2 OZ
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2.5mil/2.5mil
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1 OZ
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3.0mil/3.0mil
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2OZ
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4.0mil/4.0mil
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Min certer distance incontigeous finger
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0.10mm
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Min single line impedancetolerance
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50Ω+/-10%
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Impedance
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100Ω+/-10%
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SolderingResistance
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85---105°C / 280°C---360°C
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Basedmaterial(PI) thickness
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0.025mm---0.125mm
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Item
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Surface Treatment Thickness
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PlatedTin
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Tin:1-15um
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Plated Ni/gold
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Ni:2-8um
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Gold:0.03-0.15um
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ENIG
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Ni: 1-6um
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Gold:0.03-0.10um
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OSP
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OSPfilm:0.2-0.7um
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Plated Tin
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Tin:0.5-1um
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Plating
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Gold:0.25-1um
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Twining and curving resistance/Chemicalresistance
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International printed circuit IPC standard
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