Product description
Specifications:
- Selective plating finishes: electroless nickel/immersion gold,SMOBC/HASL, lead free SMOBC/HASL, organic OSP, hard and soft gold,plating tin, immersion silver and immersion tin
- Base materials: high temperature FR4/FR5, free halogen FR4,aluminum based, Nelco 4000-13, Nelco 6000, polyamide, rogers4003/4350, rogers 3010, rogers 5880/5870, Taconic RF35A, TacPreg,TacLam, Arlon 25N/25FR, other Teflon and PTFE
- Minimum track space: 4/4, 3 mils partial allowed
- Layers and type: 1 to 30 layers standard PCB, Blind vias andburied vias board
- Minimum annular ring: 3 mil for via hole, 6 mils for componenthole
- Minimum space between the holes: 12 mil
Selective plating finishes: electroless nickel/immersion gold,SMOBC/HASL, lead free SMOBC/HASL, organic OSP, hard and soft gold,plating tin, immersion silver and immersion tin
Base materials: high temperature FR4/FR5, free halogen FR4,aluminum based, Nelco 4000-13, Nelco 6000, polyamide, rogers4003/4350, rogers 3010, rogers 5880/5870, Taconic RF35A, TacPreg,TacLam, Arlon 25N/25FR, other Teflon and PTFE
Minimum track space: 4/4, 3 mils partial allowed
Layers and type: 1 to 30 layers standard PCB, Blind vias andburied vias board
Minimum annular ring: 3 mil for via hole, 6 mils for componenthole
Minimum space between the holes: 12 mil