Electroplated Diamond wire for sapphire wafering

  Electroplated Diamond wire for sapphire wafering   Our electroplated diamond wire saw is widely applied in the fields of solar energy, LED, semiconductor, precision optical components and national defense industry, etc . With outer diameter sizes are available from 0.12mm to 0.45mm presently, which are used to square, brick, crop, dice, slice, wafer the hard brittle materials on multi-wire or single wire cutting machine.    Features:
1. Lower total cost of ownership 2. Excellent cutting accuracy 3. Reduced bow and warp    Product specification and performance :

Diameter(mm)	Core Wire(mm)	Tolerance (±mm)	Break Tension (N)	Spool Wire Tension at Winding(N)	Pitch (mm)
0.25	0.18	0.01	≥75	15±1	0.5-0.6

     

Cutting Material	Diamond Wire Dia.(mm)	Cutting Machine	Cut Time (Min)	Cutting Feed Speed(mm/Min)	Cutting Tension(N)	Diamond Wire Speed(m/Min)	Wavering Angle (°)	Wavering Speed (°/Min)	Wire Consumption (m/wfr)
2”  Sapphire Ingot	Φ0.25	Takatori 612DD	190	0.27	35	400-420	5—7	250	2.5-3
4”  Sapphire Ingot	Φ0.25	Takatori 612DD	600	0.16	35	550-600	5—7	250—350	8-12
6”  Sapphire Ingot	Φ0.25	Takatori 612DD	1600	0.10	35	550-600	7—10	250—350	100-110

       Other specification can be ordered by customer.