Diamond Cutting Discs, Diamond Saw Blade

1   Resin diamond dicing blade

Introduction of Resin bond dicing blade:

Resin bond blades with the characteristic of vertical consumption can efficiently reduce the occurrence of grain deformation and improve the cutting quality and efficiency on hard and brittle materials.

Features of Resin bond dicing blade:

Improve the cutting quality and efficiency on hard and brittle materials.

A wide selection of bonds available for high-grade processing on hard and brittle materials.

Ultra thin blade (over 50um)

Applications of Resin bond dicing blade:

Hard and Brittle Materials, Ceramics, Optical Glass, Glass for Optical Fiber Communication, Splitter, IR Fil

NO.2    Metal bond dicing blade

Introduction of Metal bond dicing blade:

Metal bond blades, the sintered diamond blades with the addition of metal powder in bond, have high retaining force for grain. 
with the higher wear-resistance and advanced cutting capability and higher stiffness, the metal bond blades can effectively reduce cutting defects like slanted-kerf.

Features of Metal bond dicing blade:

Ultra thin blade (over 45um)

A wide selection of bonds available for various semiconductor packages.

Applications of Metal bond dicing blade:

Sapphire,BGA,Optical Glass,CSP