copper wire bonding

Specifications High Purity Single Crystal Copper Wire:

a) High-purity, Cu>99.9999%

b) low resistance, R>104.0%IACS

c) High elongation

Bonding wire Single crystal copper bond wire instead of the bonded gold advantages and features: 1) single crystal grain: relative to the current common copper (grain), and single crystal copper wire only a grain, internal without grain boundary. And single crystal copper rod has a density of directional solidification, eliminate the lateral boundary, there are few casting defects such as shrinkage cavity, porosity; And crystallization direction drawing in the same direction, can withstand a larger plastic deformation ability. In addition, the single crystal copper wires not hinder dislocation slip boundary, deformation, cold work, hardening reply fast, so be drawn bonding lead (0.05- 0.016 mm) of the ideal material. 2) high purity: at present, in our country, the single crystal copper wire (raw material) can do 99.999% (5 n) or 99.9999% (6 n) purity; 3) good mechanical performance, and compared with the purity of gold, has good tensile, shear strength and ductility. Single crystal copper wires because of their excellent mechanical and electrical properties and processing performance, the new technology can meet the encapsulation process, its processing to 0.05- 0.015 mm of single crystal copper ultra filament instead of gold, so that the spacing of the wire bonding are smaller and more stable. 4) electrical conductivity, good thermal conductivity, the conductivity of the single crystal copper wire, thermal conductivity, 20% higher than that of silk, so in and silk size under the same conditions can carry more current, bonding wire is less than 0.018 mm in diameter, its resistance or resistance characteristics is difficult to meet the packaging requirements. 5) low cost: the cost of single crystal copper bond wire is only 1/3 of the bonded gold - 1/10, can save bonding encapsulation material cost by 90%; Share 1/2, 1 tons of single-crystal copper wire is bonded gold alternative 2 tons of gold; The semiconductor industry today some significant changes directly affected the IC interconnection technology, the cost factor is also a main factor to promote the development of interconnect technology. Currently gold bonding length more than 5 mm, the pin count above 400, its packaging costs more than $0.2. Instead of single crystal copper wire bonding can not only reduce components manufacturing costs, improve competitive advantage. For 1 mil welding line, the cost can decrease 75%, 2 mil could reach 90%. Henan best g electronic material co., LTD., with high purity single crystal copper (OCC) to produce 18 50 um um - bonding wire of different specification, application patent technology can solve the problem of bonding wire of antioxidant, can completely replace bonded gold/bonded aluminium wire, cost savings.