BIWIN MLC NAND Flash Half Slim SSD SATAII 16G for Embedded Devices

Specifications *Suport TRIM and Garbage Collection

*Support dynamic power management and SMART

  BIWIN Half Slim SSD Product Description  

H6210
Interface:	SATAII 3Gb/s
Capacity:	16GB
Dimension:	54x 39 x4mm
Weight:	≤8.45g
Flash:	MLC
MTBF:	2,000,000 Hours
Operating Voltage:	+5.0V (±5%)
Power Consumption:	0.22W (Idle)  0.68W (Active)
Operating Temperature:	0 to 70°C
Storage Temperature:	-40 to 85°C
Humidity:	5% to 95%
[ATTO] Sequential Read (Max):	219MB/s
[ATTO] Sequential Write (Max):	48MB/s

           Company Information   About BIWIN Corporate Overview:   Founded as an electronic product manufacturer in Shenzhen, China 1995, BIWIN specializes in producing flash storage products, including solid state drives, Compact Flash cards and USB flash drives. With 18 years' industry expertise and a strong team with over 150 skilled engineers, BIWIN develops its leading edge flash storage products completely in-house, including Solution Designing, Wafer packaging, IC Testing, SMT and Assembling, Product Testing. Manufacturing is conducted according to strict quality standards to ensure consistently high quality products.     BIWIN Vision Statement:   BIWIN strives to become a leader in consumer electronic industry in the world.     BIWIN's Win-Win Philosophy:   BIWIN determines to be customer's best partner by understanding customers’needs and meeting their requirements. While customers enhance their core competitive ability, BIWIN perfects its services and becomes stronger. This is our Win-Win philosophy.     Full range of Product Line:   Including 2.5”SATA, 2.5”PATA, SATA DOM, PATA DOM, mSATA, CFast Card, CF Card, eMMC, eMCP, etc. Applicable to harsh operating temperature environments of industrial grade.     State-of-the-art Manufacturing:   -Quality Guaranteed Products
-Strict Quality Control Standards
-Short Lead Time
-Low Product Defect Rate
-Large production Capacity     Reliability Testing:   -High and Low Temperature Storage
-High and Low Temperature Operation
-High and Low Temperature Cycling
-ESD Testing 
-Vibration and Shock Testing
-Room Temperature Aging Testing
-Power Failure Testing     Wafer Packaging Service:   -First 12" Wafer Packaging Factory in South China
-Include IC Design, Packaging, Testing, Assembling
-Wafer Packaging Products:TSOP 48, QFN, QFP, BGA, LGA, eMMC, UDP.