The F solution designed for test, debug, and validation of devices of BGA, LGA, QFP, QFN, SOP, etc. For devices with more than 256 pins, please look for our [U" solution.
Test, debug, validation of devices of BGA,LGA,QFP,QFN,SOP,etc
Pitch from 0.4mm to 1.27mm
"Buy and use" modular design
Standardized design shorten lead time
Feature:
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F solution is designed for test, debug, and validation of devices of BGA, LGA, QFP, QFN, SOP, etc.
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The compact, surface mount design requires no tooling, no extra place or mounting holes in the target PC board, maximizing real estate while reducing board costs.
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Precision machined spring probes with industry proven solder balls ensure high reliability performance, easy of maintenance and reduced testing downtime.
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Fully removable double latch turning lid makes it can be used for both manual and automatic operation, and enable quick device insertion and extraction.
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Avoid problem of pad co-planarity, oxidation and damage of PC board after de-soldering comparing to conventional design, Provide protection to PC board from cutting through by probes.
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"Buy and use" modular design makes it no needs customer to provide PC board, protect customer's IP.
Specification:
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Mechanical
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Socket Body: Peek Ceramic
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Socket Lid: AL,Cu,POM
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Contact: Spring Probe
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Solder Ball: RoHS Compliant(Lead-free) 96.5Sn/3.0Ag/0.5Cu(SAC305)
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Operation Temperature: -40ºC to 140ºC
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Life Span at Operating Travel:100K cycles Min.
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Cycles Spring Force: 20g ~ 30g per Pin
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Electrical
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Current Rating (Continuous) : 1A Min.
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DC Resistance: 100mohm Max.