Product description
Layers: 1 to 28
Board finished thickness: 0.2 to 7.0mm
Materials: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free androgers
Maximum finished board size: 23 x 25mm (580 x 900mm)
Minimum drilled hole size: 3mil (0.075mm)
Minimum line width: 3mil (0.075mm)
Minimum line spacing: 3mil (0.075mm)
Surface finish/treatment: HASL/HASL lead-free, HAL, chemicaltin, chemical gold,
immersion silver/gold, OSP and gold-plating
Copper thickness: 0.5 to 7.0oz
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0µm (>1mil)
Inner packing: vacuum packing/plastic bag
Outer packing: standard carton packing
Shape tolerance: ±0.13
Hole tolerance:
UL pending, SGS- and RoHS-approved
Special requirements: buried and blind vias, controlledimpedance and BGA
Profiling: punching, routing, V-cut and beveling
PTH: ±0.076
NPTH: ±0.05