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4-layer BGA immersion gold board, thickness of 1.6mm PCB
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| Model No. : | JXC002-1 |
|---|
Jasecen International (HK) Co. Ltd
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Product description
- Multilayer rigid PCBs up to 18 layers
- Flexible and flex-rigid circuits up to 18 layers
- Controlled impedance
- HDI (high density interconnect)
- Blind and buried via holes
- Certification: UL marks
- Compliant with RoHS Directive
- FR4 standard epoxy and high temperature versions
- Polyamide, polyester and PET
- PTFE (poly-tetra fluorethylene) and Duroid (glass reinforced PTFE composite)
- Aluminum based materials
- Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
- CNC routing
- Scoring (V grooving)
- Gold on nickel contact fingers
- LPSM (liquid photo image-able solder mask) range of colors available
- Peelable solder mask
- Screened conductive Inks (carbon)
- Bare board electrical testing
- Immersion silver
- Immersion gold
- Lead free or HASL (hot air solder leveling)
- OSP (organic surface preservative)
- Gold finger
- Plating gold
- Immersion tin
- PCB design
- Circuit layout and drafting
- PCB copy
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