0.12mm Silicon Adhesive High-temp Masking Tape Used In Taping Of Electronic Components

 

0.12mm Silicon Adhesive High-Temp Masking Tape Used in Taping of Electronic Components

 SY1226

Backing :Crepe paper          

 Adhesive :Silicon

Width(mm):Random            

Length(m):as customer’s requirement 

Thickness :0.12mm            

 Adhesion(N/in):6

Ball tack(NO.#7):10           

Holding power(Hrs):72

Tensile strength(N/in):100     Elongation(%);9

Temp.resistance(0C):150

 Features:
With nice tensile strength and no adhesive residue
Applied to toasts many times under environment of high temperature

Applications:widely used in  electronic components such as ceramic or multilayer metalized capacitor, radial leads and thermal resistor

TEST ITEM	TEST METHOD	TECH  DATA
THICKNESS(mm)	GB/T7125-1999	0.12±0.01
ADHESION(N/ mm)	GB/T2792-1998	6↑
BALL TACK(NO.#7)	GB/T4852-2002	10↓
HOLDING POWER(Hrs)	GB/T4851-1998	72
TENSILE STRENGTH(N/ mm)	GB7753-1987	100
ELONGATION(%)	GB7753-1987	9↑
TEMP.RESISTANCE(0C)	Roaster Test	150
WIDTH(mm)	Measured By Caliper Slide		±0.2
LENGTH(m)	Measured by electronic counter		±1%
Note: Place and store in normal temperature ,six months validity from the date of production